XR-UPW-501
Grade B · Specialty Series
Proprietary Application Media
UPW-Ultra™ Final Polishing Mixed Bed
Wafer-grade final polishing mixed bed with extremely low leachables.
Final polishing mixed-bed medium for semiconductor and photovoltaic UPW systems. Uniform-particle gel cation/anion resins blended in optimized ratio, focused on controlling resin leachables and rinse-down time—for trace-ion and TOC control at the UPW system outlet.
| Grade | XR-UPW-501 UPW-Ultra™ Final Polishing Mixed Bed |
|---|---|
| Ionic Form | H+/OH- mixed (polishing mixed bed) |
| Matrix | Styrene-divinylbenzene (DVB) |
| Structure | Uniform-Particle Gel |
| Suitable Conditions | Wafer-grade final polishing / UPW purification · trace-ion control at the UPW outlet · new/change-out services sensitive to rinse-down time |
| Not Recommended (assess first) | Direct feed of high-TOC raw water (pre-treat with UV/UF) · first commissioning without UPW-procedure pre-treatment |
| Particle Size · Packaging · Shelf Life | 0.3 - 1.2 mm · packaging and shelf life per grade TDS |
| Total exchange capacity | 1.9 eq/L cation / 1.1 eq/L anion |
| TOC contribution | < 1 ppb (typical) |
| Moisture retention | 45 - 58 % |
| Particle size | 0.3 - 1.2 mm, uniform |
| Operating pH | 0 - 14 |
| Max. operating temperature | 60 °C |
| Regeneration | 2 - 4 BV HCl / NaOH |
| Typical values for this grade family; contract values are set by the batch CoA/TDS. | |
| Documents | Download TDS / MSDS from the top of the page; CoA samples and third-party verification reports are available on request on request |
Parameters on this page are representative descriptions under typical test conditions and do not constitute a performance commitment; specific values are governed by the corresponding grade's batch CoA and TDS. Where operating boundaries are unclear, we recommend starting with a service assessment。